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Associate Editors
    Prof. Fatih Dogan
    Dept. of Secondary Sci. Math. Education
    Canakkale Onsekiz Mart University
    Canakkale 17100, Turkey

    Prof. Patrice Berthod
    Dept. of Chem. and Phys. of Solids & Surfaces
    University of Lorraine
    54506 Vandoeuvre-Les-Nancy, France

    Prof. Scott Mao
    Dept. of Mech. Eng. & Mater. Sci.
    University of Pittsburgh
    Pennsylvania 15260, USA

    Prof. Peter Foot
    Dept. of Mater. Chem.
    Kingston University
    Kingston KT1 2EE, UK

Managing Editor
    Prof. Chang-Koon Choi
    Korea Advanced Institute of Science & Technology
    Daejeon 305-701, Korea

 SCOPUS (CiteScore: 3.8)
ISSN: 2234-0912(Print), ISSN: 2234-179X(Online)
Vol.13(4 issues) for 2024, Quarterly
Hybrid Open Access journal: there is an Optional Open Access Fee of USD 295.
For correspondence:
Aims and Scope

The Advances in Materials Research (AMR), An International Journal, aims at opening a new access to information about the current advances in interdisciplinary materials research and providing an excellent publication channel for the global community of materials research. The areas covered by AMR journal include the interdisciplinary research in;

* Metals,
* Ceramics,
* Polymers,

with applications in Electrical, Biochemical Materials, and Nano Structural Materials.
Editorial Board

Dr. J.I. Alvarez
Univ of Navarra
Pamplona 31080, Spain

Dr. M.H. Asgahar
Univ of the Punjab
Lahore 54590, Pakistan

Dr. Y. Bar-Cohen
Jet Propulsion Lab/Caltech/NASA
Pasadena, CA 91109, USA

Prof. L.Q. Chen
Northeastern Univ
Shenyang 110819, China

Prof. S.W. Chen
National Tsing Hua Univ
Hsinchu 30013, Taiwan

Dr. S. Choi
NASA Langley Research Center
Hampton, VA 23681-2199, USA

Dr. J.M.F. Ferreira
CICECO University of Aveiro
Aveiro 3810-193, Portugal

Prof. M.J. Jackson
Purdue Univ
W. Lafayette, IN 47907-2021, USA

Prof. J.W. Jiang
National Univ of Singapore
117576, Singapore

Prof. H.J. Jung
Daejeon 34141, Korea

Prof. Y. Kagawa
The Univ of Tokyo
Tokyo 153-8904, Japan

Dr. C. Karunakaran
Annamalai Univ
Annamalainagar 608002, India

Dr. X.H. Lu
Nanyang Technol Univ
639798, Singapore

Prof. E.J. Mittemeijer
Univ of Stuttgart
Stuttgart, D-70569, Germany

Dr. D. Mukherji
Braunschweig Univ of Technol
Braunschweig, D-38106, Germany

Prof. M. Nygren
Univ of Stockholm
Stockholm 10691, Sweden

Dr. S.K. Pabi
Indian Inst of Tech Kharagpur
Kharagpur, 721302, India

Dr. M. Paranthaman
Oak Ridge Nat Lab
Oak Ridge, TN 37831-6100, USA

Dr. M. Pracella
Univ of Pisa
Pisa 56122, Italy

Dr. M. Shahinpoor
Univ of Maine
Orono, ME 04469-5711, USA

Dr. A. Sodergard
Lab of Polymer Technol
Turku 20500, Finland

Prof. G.B. Song
Univ of Houston
Houston, TX 77204-4006, USA

Prof. T.S. Srivatsan
The Univ of Akron
Akron, OH 44325-3903, USA

Prof. J. Wang
Purdue Univ
W. Lafayette, IN 47907-2021, USA

Prof. Y.W. Yang
Nanyang Technol Univ
Nanyang 639798, Singapore

Prof. X. Yao
Griffith Univ
Queensland 4111, Australia

Prof. B.S. Yilbas
King Fahd Univ of Petrol & Miner
Dhahran 31261, Saudi Arabia

Prof. M. Yoshimura
Nat Cheng Kung Univ
Tainan 70101, Taiwan

Prof. J. Zhang
Los Alamos Nat Lab
Los Alamos, NM 87545, USA

Dr. L.C. Zhang
Edith Cowan Univ
Perth, WA 6027, Australia

Prof. Y. Zhang
Univ of Sci and Tech Beijing
Beijing, 100083, China

Guide to Authors (Last updated: Oct 25, 2023)

1. Submission of the paper
Authors are asked to submit manuscripts in PDF (or Latex) format electronically through the Techno-Press Manuscript Upload System (TeMUS) ( Exceptionally, the special issue papers may be directly submitted to the Guest Editor. If you have difficulties in using TeMUS, please contact us at[]. On receiving submitted papers, the system will issue the paper ID and Password to the corresponding author which may be conveniently used to check the status of submitted papers. Authors should carefully check if their paper satisfied all the requirements in the preliminary list before submission.

2. Preparation of the manuscript
General : The manuscripts should be in English and typed with single column and single line spacing on single side of A4 paper. Submitted papers will be published in regular technical paper only. The first page of an article should contain; (1) a title of paper which well reflects the contents of the paper (Arial, 16pt), (2) all the name(s) and affiliations(s) of authors(s) (Arial, 12pt), (3) an abstract of 100~250 words (Times New Roman, 11pt), (4) 5-10 keywords following the abstract, and (5) footnote (personal title and email address of the corresponding author (required) and other authors' (not mandatory)). The paper should be concluded by proper conclusions which reflect the findings in the paper. The normal length of the technical paper should be about 12-24 journal pages. Authors are advised to read the details in the Authors' Guide for guide and Template.
Tables and figures : Tables and figures should be consecutively numbered and have short titles. They should be referred to in the text as following examples (e.g., Fig. 1(a), Figs. 1 and 2, Figs. 1(a)-(d) / Table 1, Tables 1-2), etc. Tables should have borders (1/2pt plane line) with the captions right before the table. Figures should be properly located in the text as an editable image file (.jpg) with captions on the lower cell. All of the original figures and tables are required to be placed at the suitable locations in the text.
Units and mathematical expressions : It is desirable that units of measurements and abbreviations should follow the System Internationale (SI) except where the other unit system is more suitable. The numbers identifying the displayed mathematical expression should be placed in the parentheses and referred to in the text as following examples (e.g., Eq. (1), Eqs. (1)-(2)). Mathematical expressions must be inserted as an object (set as Microsoft Equations 3.0) for Microsoft Word 2007 and after versions. Image-copied text or equations are not acceptable unless they are editable. The raised and lowered fonts cannot be used for superscription and subscription.
References : A list of references which reflect the current state of technology in the field locates after conclusions of the paper. For details to prepare the list of references and cite them in the text, authors are advised to follow the introduction and the sample list in the Authors' Guide.

3. Review
All the submitted papers that have passed the preliminary check by the editors will undergo a rigorous peer-review process to judge their significance and originality. Those papers positively recommended by at least two expert reviewers will be finally accepted for publication in the Techno-Press Journals or after any required modifications are made.

4. Proofs
Proofs will be sent to the corresponding author to correct any typesetting errors. Alterations to the original manuscript will not be accepted at this stage. Proofs should be returned within 48 hours of receipt.

5. Copyright
Submission of an article to a Techno-Press Journal implies that it presents the original and unpublished work, and not under consideration for publication elsewhere. On acceptance of the submitted manuscript, it is implied that the copyright thereof is transferred to the Techno-Press. The Agreement of Authorship, Originality, and Copyright Transfer must be signed and submitted.

6. Ethics
General: Techno-Press applies research and publication ethics standards based on COPE's International Standards for Editors and Authors ( Violation of publication ethics will result in the activation of COPE flow chart. (
Authorship: Authors are encouraged to check ICMJE's guideline for authorship. ( Authorship problems will be dealt with according to COPE flowcharts. (

7. Open Access
There is an option of publishing your paper as Open Access. When you receive a formal acceptance email, you will find a link that you may click on to pay the Article Processing Charge (APC) for Open Access publishing.

Sample issue
Volume 1, Number 1, March 2012
  • One-pot synthesis of gold trisoctahedra with high-index facets
    Do Youb Kim, Kyeong Woo Choi, Sang Hyuk Im, O Ok Park, Xiao-Lan Zhong and Zhi-Yuan Li
    Abstract; Full Text (15391K)

There have been many efforts on the generating metal nanocrystals enclosed by high-index facets for the use as highly active catalysts. This paper describes a facile synthesis of Au Trisoctahedra with high-index facets. In brief, the Au trisoctahdra were prepared by reduction of HAuCl4 in N,Ndimethylformamide (DMF) containing poly (vinyl pyrrolidone) (PVP) and trace amount of AgNO3. The Ag ions in the reaction solution played a critical role in controlling the trisoctahedral shape of the final product by underpotential deposition (UPD) on the Au surfaces. The as-prepared Au trisoctahedra were single crystal and enclosed by high-index {441}, {773} and {331} facets.

Key Words
gold; trisoctahedra; transformation; underpotential deposition; silver

Do Youb Kim, Kyeong Woo Choi and O Ok Park: Department of Chemical and Biomolecular Engineering (BK21 graduate program), Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 305-701, Republic of Korea. O Ok Park: Department of Energy Systems Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 50-1, Sang-ri, Hyeonpung-myeon, Dalseong-gun, Daegu 711-873, Republic of Korea. Sang Hyuk Im: KRICT-EPFL Global Research Laboratory, Advanced Materials Division, Korea Research Institute of Chemical Technology (KRICT), 19 Sinseongno, Yuseong-gu, Daejeon 305-600, Republic of Korea. Xiao-Lan Zhong and Zhi-Yuan Li: Institute of Physics, Chinese Academy of Science, P. O. Box 603, Beijing 100080, People

  • High performance ultrafine-grained Ti-Fe-based alloys with multiple length-scale phases
    Lai-Chang Zhang
    Abstract; Full Text (8246K)

In order to simultaneously enhance the strength and plasticity in nanostructured / ultrafinegrained alloys, a strategy of introducing multiple length scales into microstructure (or called bimodal composite microstructure) has been developed recently. This paper presents a brief overview of the alloy developement and the mechanical behavior of ultrafine-grained Ti-Fe-based alloys with different lengthscale phases, i.e., micrometer-sized primary phases (dendrites or eutectic) embedded in an ultrafinegrained eutectic matrix. These ultrafine-grained titanium bimodal composites could be directly obtained through a simple single-step solidification process. The as-prepared composites exhibit superior mechanical properties, including high strength of 2000-2700 MPa, large plasticity up to 15-20% and high specific strength. Plastic deformation of the ultrafine-grained titanium bimodal composites occurs through a combination of dislocation-based slip in the nano-/ultrafine scale matrix and constraint multiple shear banding around the micrometer-sized primary phase. The microstructural charactersitcs associated to the mechanical behaivor have been detailed discussed.

Key Words
titanium alloy; bimodal composite; multiple length scales; ultrafine-grained; mechanical behavior; microstructure

School of Mechanical and Chemical Engineering, The University of Western Australia, 35 Stirling Highway, Crawley, Perth, WA 6009, Australia

  • Dental arch wires with tooth-like color
    Sinn-wen Chen, Hsin-jay Wu, Chih-hao Liu, Yuan-chun Chien and Chih-chang Hu
    Abstract; Full Text (3259K)

Unique tooth-like (milky white) color

Key Words
orthodontic materials; surface properties; anodization; tooth color

Department of Chemical Engineering, National Tsing Hua University, #101, Sec. 2, Kuang-Fu Road, Hsin-Chu 300, Taiwan

  • Characterization of high performance CNT-based TSV for high-frequency RF applications
    Sukeshwar Kannan, Bruce Kim, Anurag Gupta, Seok-Ho Noh and Li Li
    Abstract; Full Text (3094K)

In this paper, we present modeling and characterization of CNT-based TSVs to be used in high-frequency RF applications. We have developed an integrated model of CNT-based TSVs by incorporating the quantum confinement effects of CNTs with the kinetic inductance phenomenon at high frequencies. Substrate parasitics have been appropriately modeled as a monolithic microwave capacitor with the resonant line technique using a two-polynomial equation. Different parametric variations in the model have been outlined as case studies. Furthermore, electrical performance and signal integrity analysis on different cases have been used to determine the optimized configuration for TSV-based CNTs for high frequency RF applications.

Key Words
TSV; CNT; modeling; signal integrity; high-frequency; RF applications

Sukeshwar Kannan, Bruce Kim and Anurag Gupta: University of Alabama, Tuscaloosa, Alabama, 35487-0286 USA. Seok-Ho Noh: Andong National University, South Korea. Li Li: Cisco Systems, Inc., USA.

  • Characterization of rapidly consolidated r-TiAl
    Kunal Kothari, Ramachandran Radhakrishnan, Tirumalai S. Sudarshan and Norman M. Wereley
    Abstract; Full Text (20203K)

A powder metallurgy-based rapid consolidation technique, Plasma Pressure Compaction (P2C

Key Words
intermetallics; grain size; rapid consolidation; titanium aluminide; powder metallurgy

Composites Research Laboratory, Department of Aerospace Engineering, University of Maryland, College Park, MD 20742, USA

  • Size control of Co-doped ZnO rods by changing the solvent
    Jing Zhao, Xiaoqin Yan, Yang Lei, Yanguang Zhao, Yunhua Huang and Yue Zhang
    Abstract; Full Text (4715K)

In this work, the Co-doped ZnO rods were prepared by the hydrothermal method. The size of these rods can be changed from micro-size to nano-size by using different solutions during the preparation. The results of transmission electron microscopy (TEM) and selected area electron diffraction (SAED) showed that the as-prepared nano-sized Co-doped rods have single-crystal structure. The polarized Raman experiments were presented on an individual micro-sized Co-doped ZnO rod in the X(YY) , X(ZY) and X(ZZ) configurations, the results of polarized Raman indicated that these rods are crystallized and their growth direction is parallel to c-axis.

Key Words
ZnO; Co-doping; hydrothermal method; transmission electron microscopy; polarized Raman

Department of Materials Physics and Chemistry, State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, 30 Xueyuan Road, Beijing 100083, China

  • Effect of under-bump-metallization structure on electromigration of Sn-Ag solder joints
    Hsiao-Yun Chen, Min-Feng Ku and Chih Chen
    Abstract; Full Text (7456K)

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from 135oC to 165oC. The UBM structures were examined: 5-

Key Words
electromigration; solder joints

Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan, Republic of China

Epoxy resin is widely used in high voltage apparatus as insulation. Fillers are often added to epoxy resin to enhance its mechanical, thermal and chemical properties. The addition of fillers can deteriorate electrical performance. With the new development in nanotechnology, it has been widely anticipated that the combination of nanoparticles with traditional resin systems may create nanocomposite materials with enhanced electrical, thermal and mechanical properties. In the present paper we have carried out a comparative study on dielectric properties, space charge and dielectric breakdown behavior of epoxy resin/nanocomposites with nano-fillers of SiO2 and Al2O3. The epoxy resin (LY556), commonly used in power apparatus was used to investigate the dielectric behavior of epoxy resin/nanocomposites with different filler concentrations. The epoxy resin/nanocomposite thin film samples were prepared and tests were carried out to measure their dielectric permittivity and tan delta value in a frequency range of 1 Hz - 1 MHz. The space charge behaviors were also observed by using the pulse electroacoustic (PEA) technique. In addition, traditional epoxy resin/microcomposites were also prepared and tested and the test results were compared with those obtained from epoxy resin/nanocomposites.

Key Words
nanocomposites; epoxy resin; nanofillers; dielectric properties; space charg; dielectric strength

School of Electronics and Computer Science, University of Southampton, Southampton, United Kingdom

Table of Contents.
  • 2024  Volume 13      No. 1      No.2    No.3
  • 2023  Volume 12      No. 1      No.2    No.3    No.4
  • 2022  Volume 11      No. 1      No.2    No.3    No.4
  • 2021  Volume 10      No. 1      No.2    No.3    No.4
  • 2020  Volume 9      No. 1      No.2    No.3    No.4
  • 2019  Volume 8      No. 1      No.2    No.3    No.4
  • 2018  Volume 7      No. 1      No.2    No.3
  • 2017  Volume 6      No. 1      No.2    No.3    No.4
  • 2016  Volume 5      No. 1      No.2    No.3    No.4
  • 2015  Volume 4      No. 1      No.2    No.3    No.4
  • 2014  Volume 3      No. 1      No.2    No.3    No.4
  • 2013  Volume 2      No. 1      No.2    No.3    No.4
  • 2012  Volume 1      No. 1      No.2    No.3    No.4


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