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  Volume 4, Number 1, January 2019, pages 33-41
DOI: https://doi.org/10.12989/acd.2019.4.1.033
 
open access

Investigation of bonding properties of Al/Cu bimetallic laminates fabricated by the asymmetric roll bonding techniques
Mohamad Heydari Vini and Saeed Daneshmand

 
Abstract
    In this study, 2-mm Al/Cu bimetallic laminates were produced using asymmetric roll bonding (RB) process. The asymmetric RB process was carried out with thickness reduction ratios of 10%, 20% and 30% and mismatch rolling speeds 1:1, 1:1.1 and 1:1.2, separately. For various experimental conditions, finite element simulation was used to model the deformation of bimetallic Al/Cu laminates. Specific attention was focused on the bonding strength and bonding quality of the interface between Al and Cu layers in the simulation and experiment. The optimization of mismatch rolling speed ratios was obtained for the improvement of the bond strength of bimetallic laminates during the asymmetric RB process. During the finite element simulation, the plastic strain of samples was found to reach the maximum value with a high quality bond for the samples produced with mismatch rolling speed 1:1.2. Moreover, the peeling surfaces of samples around the interface of laminates after the peeling test were studied to investigate the bonding quality by scanning electron microscopy.
 
Key Words
    asymmetric roll bonding; bond strength; peeling test; bimetal laminates; finite element method
 
Address
Mohamad Heydari Vini: Department of Mechanical Engineering, Mobarakeh Branch, Islamic Azad University, Mobarakeh, Isfahan, Iran
Saeed Daneshmand: Department of Mechanical Engineering, Majlesi Branch, Islamic Azad University, Isfahan, Iran
 

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