Techno Press
You logged in as Techno Press

Structural Engineering and Mechanics
  Volume 69, Number 4, February25 2019 , pages 467-477

Tensile and fracture characterization using a simplified digital image correlation test set-up
Abhishek Kumar, S. Vishnuvardhan, A. Ramachandra Murthy and G. Raghava

    Digital image correlation (DIC) is now a popular and extensively used full-field metrology technique. In general, DIC is performed by using a turnkey solution offered by various manufacturers of DIC. In this paper, a simple and economical set-up for DIC is proposed which uses easily accessible digital single-lens reflex (DSLR) camera rather than industrial couple-charged device (CCD) cameras. The paper gives a description of aspects of carrying a DIC experiment which includes experimental set-up, specimen preparation, image acquisition and analysis. The details provided here will be helpful to carry DIC experiments without specialized DIC testing rig. To validate the responses obtained from proposed DIC set-up, tension and fatigue tests on specimens made of IS 2062 Gr. E300 steel are determined. Tensile parameters for a flat specimen and stress intensity factor for an eccentrically-loaded single edge notch tension specimen are evaluated from results of DIC experiment. Results obtained from proposed DIC experiments are compared with those obtained from conventional methods and are found to be in close agreement. It is also noted that the high resolution of DSLR allows the use of proposed approach for fracture characterization which could not be carried out with a typical turnkey DIC solution employing a camera of 2MP resolution.
Key Words
    digital image correlation; DSLR; fracture characterization; SIF; tensile properties
Abhishek Kumar and S. Vishnuvardhan:
1) CSIR – Structural Engineering Research Centre, Chennai, India
2) Academy of Scientific and Innovative Research (AcSIR), India
A. Ramachandra Murthy and G. Raghava: CSIR – Structural Engineering Research Centre, Chennai, India

Techno-Press: Publishers of international journals and conference proceedings.       Copyright © 2023 Techno Press
P.O. Box 33, Yuseong, Daejeon 305-600 Korea, Tel: +82-42-828-7996, Fax : +82-42-828-7997, Email: