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Structural Engineering and Mechanics
  Volume 55, Number 5, September10 2015 , pages 1015-1035
DOI: https://doi.org/10.12989/sem.2015.55.5.1015
 


Characteristic analysis on train-induced vibration responses of rigid-frame RC viaducts
Liangming Sun, Xingwen He, Toshiro Hayashikawa and Weiping Xie

 
Abstract
    A three-dimensional (3D) numerical analysis for the train-bridge interaction (TBI) system is actively developed in this study in order to investigate the vibration characteristics of rigid-frame reinforced concrete (RC) viaducts in both vertical and lateral directions respectively induced by running high-speed trains. An analytical model of the TBI system is established, in which the high-speed train is described by multi-DOFs vibration system and the rigid-frame RC viaduct is modeled with 3D beam elements. The simulated track irregularities are taken as system excitations. The numerical analytical algorithm is established based on the coupled vibration equations of the TBI system and verified through the detailed comparative study between the computation and testing. The vibration responses of the viaducts such as accelerations, displacements, reaction forces of pier bottoms as well as their amplitudes with train speeds are calculated in detail for both vertical and lateral directions, respectively. The frequency characteristics are further clarified through Fourier spectral analysis and 1/3 octave band spectral analysis. This study is intended to provide not only a simulation approach and evaluation tool for the train-induced vibrations upon the rigid-frame RC viaducts, but also instructive information on the vibration mitigation of the high-speed railway.
 
Key Words
    vibration response; rigid-frame RC viaduct; high-speed train; the train-bridge interaction; characteristic analysis
 
Address
Liangming Sun and Weiping Xie: School of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan 430070, China
Liangming Sun, Xingwen He and Toshiro Hayashikawa: Graduate School of Engineering, Hokkaido University, Sapporo 060-8628, Japan
 

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