Techno Press
You logged in as Techno Press


  Volume 4, Number 1, March 2022 , pages 1-21
DOI: https://doi.org/10.12989/cme.2022.4.1.001
 
 open access

A hierarchical micromechanics model for nonlinear behavior with damage of SMC composites with wavy fiber
Fei-Yan Zhu, Hyoung Jun Lim, Hoil Choi and Gun Jin Yun

 
Abstract
    This paper presents a novel hierarchical micromechanics model to simulate Sheet Molding Compound (SMC) composites with wavy fibers. The three-step homogenizations are integrated to calculate the effective properties of SMC chips, layers, and composites, respectively. During homogenization, it has a unique capability of modeling the wavy fibers within fiber chips through a rotational transformation. The orientation and overlapping of the fiber chips caused by the manufacturing process are considered through the proposed multi-site (MS) micromechanics model. Furthermore, J2 plasticity and Lemaitre-Chaboche ductile damage models are adopted to estimate the nonlinear behavior of SMC composites. The nonlinear behavior of SMC composites is predicted based on the concurrent simulations at each homogenization. The comparison with results from experiments and the literature validates the proposed hierarchical model. Finally, a parametric study investigates the effects of fiber waviness and chip orientation on the effective behavior of SMC composites.
 
Key Words
    fiber waviness; Mori-Tanaka; multiscale modeling; random distribution; sheet molding compound
 
Address
Fei-Yan Zhu: Department of Aerospace Engineering, Seoul National University, Gwanak-gu, Seoul, 08826, Korea
Hyoung Jun Lim: Department of Aerospace Engineering, Seoul National University, Gwanak-gu, Seoul, 08826, Korea
Hoil Choi: Department of Aerospace Engineering, Seoul National University, Gwanak-gu, Seoul, 08826, Korea
Gun Jin Yun: Department of Aerospace Engineering, Seoul National University, Gwanak-gu, Seoul, 08826, Korea; Institute of Advanced Aerospace Technology, Seoul National University, Gwanak-gu, Seoul, 08826, Korea
 

Techno-Press: Publishers of international journals and conference proceedings.       Copyright © 2023 Techno Press
P.O. Box 33, Yuseong, Daejeon 305-600 Korea, Tel: +82-42-828-7996, Fax : +82-42-828-7997, Email: info@techno-press.com