Volume 3, Number 3, August 2021 , pages 221-239 DOI: https://doi.org/10.12989/cme.2021.3.3.221 |
||
![]() Micro-CT image-based reconstruction algorithm for multiscale modeling of Sheet Molding Compound (SMC) composites with experimental validation |
||
Hyoung Jun Lim, Hoil Choi, Sang-Jae Yoon, Sang Won Lim, Chi-Hoon Choi and Gun Jin Yun
|
||
Abstract | ||
This paper presents a multiscale modeling method for sheet molding compound (SMC) composites through a novel bundle packing reconstruction algorithm based on a micro-CT (Computed Tomography) image processing. Due to the complex flow pattern during the compression molding process, the SMC composites show a spatially varying orientation and overlapping of fiber bundles. Therefore, significant inhomogeneity and anisotropy are commonly observed and pose a tremendous challenge to predicting SMC composites' properties. For high-fidelity modeling of the SMC composites, the statistical distributions for the fiber orientation and local volume fraction are characterized from micro-CT images of real SMC composites. After that, a novel bundle packing reconstruction algorithm for a high-fidelity SMC model is proposed by considering the statistical distributions. A method for evaluating specimen level's strength and stiffness is also proposed from a set of high-fidelity SMC models. Finally, the proposed multiscale modeling methodology is experimentally validated through a tensile test. | ||
Key Words | ||
composite materials; finite element method; multiscale modeling; reconstruction algorithm; sheet molding compound | ||
Address | ||
Hyoung Jun Lim and Hoil Choi: Department of Aerospace Engineering, Seoul National University, Seoul, 08826, South Korea Sang-Jae Yoon, Sang Won Lim and Chi-Hoon Choi: Research & Development Division, Hyundai Motor Company, Gyeonggi, 18280, South Korea Gun Jin Yun: Department of Aerospace Engineering, Seoul National University, Seoul, 08826, South Korea/ Institute of Advanced Aerospace Technology, Seoul National University, Seoul, 08826, South Korea | ||