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Advances in Nano Research
  Volume 5, Number 4, December 2017 , pages 359-372
DOI: https://doi.org/10.12989/anr.2017.5.4.359
 


Synthesis of metallic copper nanoparticles and metal-metal bonding process using them
Yoshio Kobayashi, Hiroaki Nakazawa, Takafumi Maeda, Yusuke Yasuda and Toshiaki Morita

 
Abstract
    Metallic copper nanoparticles were synthesised by reduction of copper ions in aqueous solution, and metal-metal bonding by using the nanoparticles was studied. A colloid solution of metallic copper nanoparticles was prepared by mixing an aqueous solution of CuCl2 (0.01 M) and an aqueous solution of hydrazine (reductant) (0.2-1.0 M) in the presence of 0.0005 M of citric acid and 0.005 M of n-hexadecyltrimethylammonium bromide (stabilizers) at reduction temperature of 30-80°C. Copper-particle size varied (in the range of ca. 80-165 nm) with varying hydrazine concentration and reduction temperature. These dependences of particle size are explained by changes in number of metallic-copper-particle nuclei (determined by reduction rate) and changes in collision frequency of particles (based on movement of particles in accordance with temperature). The main component in the nanoparticles is metallic copper, and the metallic-copper particles are polycrystalline. Metallic-copper discs were successfully bonded by annealing at 400°C and pressure of 1.2 MPa for 5 min in hydrogen gas with the help of the metallic-copper particles. Shear strength of the bonded copper discs was then measured. Dependences of shear strength on hydrazine concentration and reduction temperature were explained in terms of progress state of reduction, amount of impurity and particle size. Highest shear strength of 40.0 MPa was recorded for a colloid solution prepared at hydrazine concentration of 0.8 M and reduction temperature of 50°C.
 
Key Words
    metal nanoparticle; nano-particles; nanosized metals; chemical synthesis; nano-materials
 
Address
(1) Yoshio Kobayashi, Hiroaki Nakazawa, Takafumi Maeda:
Department of Biomolecular Functional Engineering, College of Engineering, Ibaraki University, 4-12-1 Naka-narusawa-cho, Hitachi, Ibaraki 316-8511, Japan;
(2) Yusuke Yasuda, Toshiaki Morita:
Hitachi Research Laboratory, Hitachi Ltd., 7-1-1 Omika-cho, Hitachi, Ibaraki 319-1292, Japan.
 

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