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Advances in Materials Research Volume 1, Number 1, March 2012 , pages 83-92 DOI: https://doi.org/10.12989/amr.2012.1.1.083 |
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Effect of under-bump-metallization structure on electromigration of Sn-Ag solder joints |
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Hsiao-Yun Chen, Min-Feng Ku and Chih Chen
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| Abstract | ||
| The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from 135oC to 165oC. The UBM structures were examined: 5- | ||
| Key Words | ||
| electromigration; solder joints | ||
| Address | ||
| Department of Materials Science and Engineering, National Chiao Tung University, Hsin-chu 30010, Taiwan, Republic of China | ||
