Techno Press
You logged in as Techno Press

Advances in Aircraft and Spacecraft Science
  Volume 5, Number 6, November 2018 , pages 633-652

Numerical simulation of the thermoelectric behavior of CNTs/CFRP aircraft composite laminates
Yueguo Lin, Marie Christine Lafarie-Frenot, Jinbo Bai and Marco Gigliotti

    The present paper focuses on the development of a model for simulating the thermoelectric behavior of CNTs/CFRP Organic Matrix Composite (OMC) laminates for aeronautical applications. The model is developed within the framework of the thermodynamics of irreversible processes and implemented into commercial ABAQUS Finite Element software and validated by comparison with experimental thermoelectric tests on two types of composites materials, namely Type A with Carbon Nanotubes (CNT) and Type B without CNT. A simplified model, neglecting heat conduction, is also developed for simplifying the identification process. The model is then applied for FEM numerical simulation of the thermoelectric response of aircraft panel structures subjected to electrical loads, in order to discuss the potential danger coming from electrical solicitations. The structural simulations are performed on quasi-isotropic stacking sequences (QI) [45/-45/90/0]s using composite materials of type A and type B and compared with those obtained on plates made of metallic material (aluminum). For both tested cases-transit of electric current of intermediate intensity (9A) and electrical loading on panels made of composite material-higher heating intensity is observed in composites materials with respect to the corresponding metallic ones.
Key Words
    CNTs/CFRP laminates; thermoelectric behavior; numerical simulations, temperature field
Yueguo Lin: Department of Design and Manufacture of Aircrafts, Civil Aviation University of China, CAUC, 2898, Road
Jinbei, District Dongli, 300300 Tianjin, China
Marie Christine Lafarie-Frenot, Marco Gigliotti: Institut Pprime, CNRS – ENSMA – Université de Poitiers, Département Physique et Mécanique de Matériaux,
ENSMA – Téléport 2 – 1, Avenue Clément Ader, BP 40109, 86961 Futuroscope Chasseneuil Cedex, France
Jinbo Bai: CentraleSupélec, Université Paris-Saclay 3 rue Joliot-Curie, 91190 Gif-sur-Yvette, France

Techno-Press: Publishers of international journals and conference proceedings.       Copyright © 2024 Techno Press
P.O. Box 33, Yuseong, Daejeon 305-600 Korea, Tel: +82-42-828-7996, Fax : +82-42-828-7997, Email: